{"product_id":"cu-interconnects-glass-and-ai-assisted-simulation-for-chiplets-and-heterogeneous-integration","title":"Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration","description":"","brand":"Springer","offers":[{"title":"Default Title","offer_id":51858012733725,"sku":"9789819568901","price":268.95,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0901\/5692\/5213\/files\/9789819568901.jpg?v=1781036882","url":"https:\/\/bookdelico.com\/products\/cu-interconnects-glass-and-ai-assisted-simulation-for-chiplets-and-heterogeneous-integration","provider":"Book Delico ","version":"1.0","type":"link"}